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Spin Cleaner×ゼビオス(XEVIOS CORP.,) - List of Manufacturers, Suppliers, Companies and Products

Spin Cleaner Product List

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Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"

One-chamber multipurpose scrub cleaning. It is possible to remove foreign substances and metal contamination in one chamber! Space-saving, making it suitable for research and development.

This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for locations with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one place ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

  • Other semiconductor manufacturing equipment

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Chemical liquid scrub spin cleaning device

Complete various cleaning processes to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.

The "Chemical Liquid Scrub Spin Cleaning Device" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical liquids, as well as contact cleaning methods like brushes. It completes the cleaning process to spin drying within a single chamber, contributing to space-saving design that reduces installation space and costs. We can propose suitable device configurations based on various equipment configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemical liquids can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can also be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Other semiconductor manufacturing equipment

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